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LENOVO M90S SFF G4 I5-13500/16GB/512SSD/WLAN/W11P/3P/SWE
Populārs
- Ražotājs: Lenovo
- Modelis: 12HQ000DMX
- EAN: 197531427564
- Pieejamība: Nav pieejams
Nosaukums:
Lenovo 12HQ000DMX
1 140,00€
Bez PVN: 942,15€
- Produktu apskats
- Specifikācija
- Atsauksmes (0)
Lenovo ThinkCentre M90s Gen4 is a Small Form Factor (SFF) business workstation designed specifically with the demanding needs of corporate use in mind.
Key Features:
Key Features:
- Operating System: Windows 11 Pro 64-bit
- 6-core Processor: Intel Core i5-13500 (14C/20T/24MB)
- Processor specifications: 6xP-core 2.5/4.8GHz, 8xE-core 1.8/3.5GHz
- Chipset: Intel Q670
- Graphics: Integrated Intel UHD Graphics 770
- Intel vPro Enterprise
- Memory: 16GB DDR5 4400MHz UDIMM (1x16)
- Maximum Memory: 128GB (4x32GB)
- Storage: 512GB SSD M.2 2280 PCIe 4.0x4 Performance NVMe Opal 2.0
- One free M.2 2280 SSD slot (installation kit 4XF1C39743)
- Additionally, 1x2.5"/3.5"HDD + 1x2.5"HDD SATA slots
- No optical drive
- Internal 1W speaker
- LAN: 100/1000M Gigabit Ethernet (Intel I219-LM)
- WLAN: Intel AX211 802.11ax 2x2 and Bluetooth 5.1
- Integrated 3-in-1 card reader (SD/SDHC/SDXC)
- Included: Lenovo USB keyboard and optical USB mouse
- Front Panel: 4xUSB 3.2, 1xUSB-C 3.2 Gen2, 1x3.5mm audio combo, 1x3.5mm Mic In
- Back Panel: 2xDisplayPort 1.4, HDMI 2.1 TMDS, 4xUSB3.2, RJ-45, 1x3.5mm Line Out
- Low profile card slots: PCIe 3.0 x1, PCIe 4.0 x16, and PCIe 4.0 x16 (x4 lanes)
- Maximum installable LP card size: 155mm (length), 70mm (height)
- Integrated TPM 2.0 security chip, TCG/FIPS 140-2 certified
- Kensington security lock slot (3x7mm)
- Internal power supply: 260W 90%
- Military-grade durability: MIL-STD-810H
- Basic warranty: 3 years Premier NBD on-site
- Weight: 5.3kg
Specifikācijas
Specification
CO2 emissions during use, kg (manufacturer?s estimate)
113
Graphics adapter family
Intel UHD Graphics
Manufacturing-related CO2 emissions, kg (manufacturer?s estimate
518.45
Operating system provided
Windows 11 Pro
Product life cycle CO2 emissions, kg (manufacturer?s estimate)
676
Product life cycle used in emission assessments, years
4
Product packaging CO2 emissions, kg (manufacturer?s estimate)
3.66
Recycling-related CO2 emissions, kg (manufacturer?s estimate)
4.49
Total storage capacity
512 GB SSD
Transportation-related CO2 emissions, kg (manufacturer?s estimat
36.4
USB-C (USB 3.2) ports quantity
1
Procesors
Intel HyperThreading
Yes
Intel Smart Cache, MB
24
Intel Turbo Boost, GHz
4.80
Intel virtualizācijas tehnoloģija
VT-x / VT-d
Intel vPro
Yes
Number of efficient-cores
8
Number of performance-cores
6
Procesora modelis
Intel Core i5-13500 (Max. 4.80GHz, 24M, 14C)
Processor clock speed, GHz
2.50
Processor manufacturer
Intel
Processor number of cores
14
Procesora saime
Intel Core i5
Atmiņa
Atmiņas sloti
4
Iekšējā atmiņa
16 GB
Iekšējās atmiņas tips
DDR5
Maximum internal memory, GB
128 GB
Memory clock speed, MHz
4400
Memory slots (available)
3
Videokarte
Grafiskais adapteris
Intel UHD Graphics 770
Atmiņas ierīce
Hardware M.2 bays
3
Integrated Memory Card Reader
Yes
Optical drive
No
RAID controller
No
Solid State Disk drive type
M.2 PCIe NVMe
Porti
DisplayPorts quantity
2
Ethernet LAN (RJ-45) ports quantity
1
HDMI portu daudzums
1
USB-A (USB 3.2) ports quantity
8
Pieslēgumi
Bluetooth
Yes
Bluetooth versija
5.1
Connections
USB-C (Gen2), USB-A (USB 3.x), HDMI, Audio (3.5mm), Ethernet (RJ-45), DisplayPort
Wireles LAN (WLAN)
Yes
WLAN antennas
2x2
WLAN type
Intel® Wi-Fi 6E AX211, 11ax 2x2
Specifikācijas
Cable lock slot
Yes
Dimensions W x D x H, mm
92.5 x 297.7 x 339.5
Motherboard chipset
Intel Q670
Operating system language
English, Norwegian, Swedish, Danish, Finnish
PCI Express x1
1
PCI Express x16
1
PCI Express x16/4x
1
Power supply, W
260
Trusted Platform Module (TPM)
Discrete
Trusted Platform Module (TPM) version
2.0
Weight, g
5300
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