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LENOVO SE30 I3/8GB/256SSD/2XRJ45/WLAN/4G/FANLESS/WIN10 IOT/3OS/SWE
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    Lenovo 11NA001NMT

  • Ražotājs: Lenovo
  • Modelis: 11NA001NMT
  • EAN: 196119741146
  • Pieejamība: 2
1 344,98€
Bez PVN: 1 111,55€
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  • Specifikācija
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Lenovo ThinkEdge SE30 is an IoT endpoint designed to provide versatile and reliable connectivity and integration into production environments. Two fixed Ethernet ports, along with wireless WLAN and 4G mobile connectivity, allow it to function as a bridge and ensure continuous connection maintenance. You can connect sensors, counters, or other smart devices in an intelligent production environment to the two serial ports, and with the optional IO BOX expansion module, you gain even broader connectivity options, such as Digital I/O and PoE connections, as well as 9-36 VDC power supply.
Its robust, compact, and fanless design ensures reliable operation in extreme conditions, and various mounting options (VESA, DIN rail, and wall mounting) make it easy to position in production facilities. Windows 10 IoT Enterprise LTSC guarantees long lifecycle support for the operating system, advanced device management, and enterprise-level security.

Key Features:
  • Operating System: Windows 10 IoT Enterprise 64-bit LTSC
  • Processor: Intel Core i3-1115GRE (2C/4T, 1.7/3.0GHz, 6MB)
  • Graphics: Integrated Intel UHD Graphics
  • Integrated Memory: 8GB DDR4 3200MHz
  • Memory: Not expandable
  • Storage: 256GB SSD M.2 2230 PCIe 3.0 NVMe
  • 1x Gigabit Ethernet + 1x 2.5 Gigabit Ethernet
  • Intel 9260 11AC 2x2 WLAN and Bluetooth 5.1
  • Quectel EM160R-GL, CAT16 4G LTE
  • Passive cooling
  • Front panel connections: 2x USB-A 3.2 Gen2, 1x USB-C 3.2 Gen2 (display support), 3.5mm audio combo, 2x serial (RS-232/422/485)
  • Back panel connections: 1x HDMI 1.4b, 2x RJ45, 1x USB-A 3.2 Gen2, 1x Thunderbolt 4/USB 4.0 (Power delivery 5V@3A, display support), Slim Tip power connector
  • Supports three displays (HDMI + 2x USB-C)
  • TPM 2.0 security chip, Kensington lock slot
  • Includes USB keyboard and mouse (Nordic layout)
  • External wide-temperature power supply: 65W
  • Weight: approximately 1kg
  • Dimensions: 179 x 88 x 51.5mm
  • Basic warranty: 3 years on-site
Operating Environment:
  • Temperature: IEC60068-2-1 Test A: Cold, IEC 60068-2-2 Test B: Dry heat, -20°C to 60°C with 0.7 m/s airflow
  • Relative humidity: IEC 60068-2-66 Damp heat, steady state 95%@40°C non-condensing
  • Shock protection: IEC 60068-2-27, shock, operating, 30G / 11ms, half sine
  • Vibration protection: IEC 60068-2-64, Vibration, Operating, 3Grms, random, 5 ~ 500Hz, 1hr/axis
  • MIL-SPEC 810H military-grade durability

Atslēgvārdi: LENOVO

Specifikācijas
Specification
Graphics adapter family Intel UHD Graphics
Operating system provided Windows 10 IoT Enterprise
Total storage capacity 256 GB SSD
USB-C (USB 3.2) ports quantity 1
Procesors
Intel HyperThreading Yes
Intel Smart Cache, MB 6
Intel Turbo Boost, GHz 3.90
Intel virtualizācijas tehnoloģija VT-x / VT-d
Intel vPro No
Procesora modelis Intel Core i3-1115GRE (Max. 3.90GHz, 6M, 2C)
Processor clock speed, GHz 1.70
Processor manufacturer Intel
Processor number of cores 2
Procesora saime Intel Core i3
Atmiņa
Atmiņas sloti 1
Iekšējā atmiņa 8 GB
Iekšējās atmiņas tips DDR4
Maximum internal memory, GB 8 GB
Memory clock speed, MHz 3200
Videokarte
Grafiskais adapteris Intel UHD Graphics
Atmiņas ierīce
Integrated Memory Card Reader No
Optical drive No
RAID controller Yes
Solid State Disk drive type M.2 PCIe NVMe
Porti
Ethernet LAN (RJ-45) ports quantity 2
HDMI portu daudzums 1
USB-A (USB 3.2) ports quantity 3
Pieslēgumi
Bluetooth Yes
Bluetooth versija 5.1
Connections Serial (RS-232), USB-A (USB 3.x), USB-C (Gen2), Audio (3.5mm), Thunderbolt 4, Ethernet (RJ-45)
Wireles LAN (WLAN) Yes
WLAN antennas 2x2
Specifikācijas
Dimensions W x D x H, mm 179 x 88 x 51.5
Motherboard chipset Intel SoC platform
PCI Express x1 N/A
PCI Express x16 N/A
PCI Express x16/4x N/A
Power supply, W 65
Trusted Platform Module (TPM) Discrete
Trusted Platform Module (TPM) version 2.0
Weight, g 1020
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